Xian Yang Tee

Patents

Inventions from the lab and the factory floor.

  • 2026
    Z-flatness mapping and testing methods for photonic integrated circuit wafer, device, and mediumPending
    Singapore patent application 10202601942Y · named inventor
  • 2025
    Method, system, medium, and device for inserting fiber array unit into the edge-coupling trench of a photonic integrated circuit (PIC) waferPending
    Singapore patent application 10202501545X · named inventor
  • 2025
    Method, system, device, and medium for FAU angle calibration in photonic integrated circuit testingPending
    Singapore patent application 10202501544Y · named inventor
  • 2025
    Method and apparatus for determining rotation center point in optical fiber moving process, device and mediumPending
    Singapore patent application 10202500586R · named inventor
  • 2025
    Wafer position calibration method and apparatus, readable storage medium and devicePending
    Singapore patent application 10202500585V · named inventor
  • 2025
    Expansion offset calibration method and apparatus, readable storage medium and devicePending
    Singapore patent application 10202500584S · named inventor
  • 2016
    Surface layer superconductor and fabrication method of the sameGranted
    Singapore Patent 11201510509W (WO 2014/207946) · co-inventor with AIST Japan and NTU · granted 2016