Patents
Inventions from the lab and the factory floor.
- 2026Z-flatness mapping and testing methods for photonic integrated circuit wafer, device, and mediumPendingSingapore patent application 10202601942Y · named inventor
- 2025Method, system, medium, and device for inserting fiber array unit into the edge-coupling trench of a photonic integrated circuit (PIC) waferPendingSingapore patent application 10202501545X · named inventor
- 2025Method, system, device, and medium for FAU angle calibration in photonic integrated circuit testingPendingSingapore patent application 10202501544Y · named inventor
- 2025Method and apparatus for determining rotation center point in optical fiber moving process, device and mediumPendingSingapore patent application 10202500586R · named inventor
- 2025Wafer position calibration method and apparatus, readable storage medium and devicePendingSingapore patent application 10202500585V · named inventor
- 2025Expansion offset calibration method and apparatus, readable storage medium and devicePendingSingapore patent application 10202500584S · named inventor
- 2016Surface layer superconductor and fabrication method of the sameGrantedSingapore Patent 11201510509W (WO 2014/207946) · co-inventor with AIST Japan and NTU · granted 2016